• WBG power device packaging & integration;

• Power module EMI & reliability issues;

• Packaging technology based high-density applications.

Projects

The Key Project of Natural Science Foundation of China 2008-2011

Large capacity and special high performance power electronics system theory and key technology research

The Key Project of Delta Science and Technology Education Development Plan Foundation of China 2010-2012

Research on key technology of high power density integration for high power inverters

140kV High Voltage, High Frequency and High Power Density X-ray Pulse Power Supply in GRC (shanghai) 2013

Research on high power density full sic converter

Google little box challenge by IEEE and Google 2014-2015

Design and build a high power density kW-scale inverter

The Project of Natural Science Foundation of China 2016-2018 (leader)

The Key Technology Research of Parasitics Reduction for Silicon Carbide (SiC) Device

The Project of Delta Science and Technology Education Development Plan 2016-2017 (leader)

The key technology research of package parasitics reduction for hybrid packaging silicon carbide devices

National key research and development program 2016-2018

Key Technology research and Application of Flexible HVDC equipment customized ultra-high-power press pack IGBT

National key research and development program 2016-2021

High-voltage SiC materials, power devices and applications in the demonstration of power electronic transformer

Papers

[1] Yue Xie, Cai Chen and Yong kang, "Using Ultra-low Parasitic Hybrid Packaging Method to Reduce High Frequency EMI Noise for SiC Power Module", the 5th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2017.

[2] Zhizhao Huang, Cai Chen and Yong Kang, "A Novel Low Inductive 3D SiC Power Module Based on Hybrid Packaging and Integration Method", ECCE, 2017.

[3] C. Chen, Y. Chen, Y. Li, Z. Huang, T. Liu, and Y. Kang, "A SiC-based Half-Bridge Module with Improved Hybrid Packaging Method for High Power Density Applications," IEEE Transactions on Industrial Electronics, vol. PP, no. 99, pp. 1-1, 2017.

[4] C. Chen, Y. Chen, Y. Tan, J. Fang, F. Luo, and Y. Kang, "On the Practical Design of a High Power Density SiC Single-Phase Uninterrupted Power Supply (UPS) System," IEEE Transactions on Industrial Informatics, vol. PP, no. 99, pp. 1-1, 2017.

[5] Teng Liu; Yue Xie; Yuxiong Li; Cai Chen; Yong Kang; Li Peng; Yingzhuo Chen; Fang Luo., "Packaging and integration of DBC-based SiC hybrid power module in 379W/in³ DC/DC converter," in 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia (IFEEC 2017 - ECCE Asia), 2017, pp. 2250-2255.

[6] Chen Cai, Pei X, Chen Y, et al. Investigation, Evaluation, and Optimization of Stray Inductance in Laminated Busbar[J]. IEEE Transactions on Power Electronics, 2014, 29(PP):1-1.

[7] Pei Xuejun, Chen Cai, Kang Yong. Analysis of Voltage Ripple and Design for DC-Link Capacitor in Three-Phase Voltage Source Inverters. Transactions of China Electrotechnical Society, 2014, 29(3): 254-259 (in Chinese).

[8] Yu Chen, Cai Chen, and Yong Kang, "General derivation law of single-switch integrated converter for dual-output, dual-input and single-stage Applications," in Proc. IEEE Energy Conversion Congress and Exposition, pp. 767-773, 2012.

[9] C. Cai, P. Xuejun, S. Yunhao, L. Xinchun, L. Xinming, and K. Yong, "Modeling and optimization of high power inverter three-layer laminated busbar," in Proc. IEEE Energy Conversion Congress and Exposition, pp. 1380-1385, 2012.

[10] Cai Chen, Xue-jun Pei, Yu Chen, and Yong Kang, "The loss calculation of RCD snubber with forward and reverse recovery effects considerations," in Proc. IEEE International Power Electronics and ECCE Asia Conf. (ICPE & ECCE), pp. 3005-3012, 2011.

[11] Cai Chen, Xue-jun Pei, Yu Chen, and Yong Kang, “A stray parameter extraction method for high power converters based on turn-on/off transient analysis,” Proceedings of the Chinese Society for Electrical Engineering, vol. 31, no. 21, pp. 40-47, 2011 (in Chinese).

Pending Patents

2017107724722，一种功率器件的三维封装结构及封装方法 (Chinese patent)

Cai Chen，Yong Kang，2017

2017108165788，一种功率器件多DBC的封装结构及封装方法 (Chinese patent)

Cai Chen，Yong Kang，2017

2016104544437，一种碳化硅功率器件的封装结构及封装方法 (Chinese patent)

Cai Chen，Yong Kang，2016

2015106079577，一种基于RSD的脉冲电源模块 (Chinese patent)

Lin Liang，Shilei Wang，Cai Chen，2015

Rewards

The International Postdoctoral Exchange Fellowship Programe, 2016

“基于封装集成技术的高功率密度碳化硅单相逆变器“ 荣获《电源学报》2016年度优秀论文